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7.8 Backlight elements
1. Illumination source flickers when lit.
2. Spots or scratches that appear when lit must be judged using LCD spot, lines and
contamination standards.
3. Backlight doesn’t light or color is wrong
7.9 Soldering
1. No unmelted solder paste may be present on the PCB.
2. No cold solder joints, missing solder connections, oxidation or icicle.
3. No residue or solder balls on PCB.
4. No short circuits in components on PCB.
7.10 General appearance
1. No oxidation, contamination, curves or, bends on interface pin (OLB) of TCP.
2. No cracks on interface pin (OLB) of TCP
3. NO contamination, solder residue or solder balls on product.
4. The IC on the TCP may not be damaged, circuits.
5. The uppermost edge of the protective strip on the interface pin must be present or look as if it
cause the interface pin to sever.
6. The residual rosin or tin oil of soldering (component or chip component) is not burned into
brown or black color.
7. Sealant on top of the ITO circuit has not hardened
8. Pin type must match type in specification sheet.
9. LCD pin loose or missing pins.
10. Product packaging must the same as specified on packaging specification sheet.
11. Product dimension and structure must conform to product specification sheet.
12. The appearance of Heat Seal should not admit any dirt and break.
8. RELIABILITY
Test Item Sample Type Test Condition
Test result
determinant gist
Normal
temperature
70¨3＂;240H
High
temperature
storage
Broad
temperature
80¨3＂;240H
Normal
temperature
-20¨3＂;240H
Low
temperature
storage
Broad
temperature
-30¨3＂;240H
High
temperature
Normal
temperature
50＂¨3＂,90%¨3%RH;240H
the inspection of
Appearance and
function character.
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